The new AMD update brings a big improvement to the Ryzen 9000 series; X870 platform begins its entry into the global market

Today AMD officially announced some good news, especially about its latest CPUs and chipsets. So make sure you speed things up if you use these.

First, the new AGESA PI 1.2.0.2 BIOS, exclusive to AMD 600 and X870 motherboards, has finally become widely available, with many motherboard partners pushing their firmware updates to their own products. A key element of the update includes improved Core-to-Core latency for Ryzen 9 9000 series desktop CPUs, as well as expanded warranty coverage for higher power levels on AMD Ryzen 9600X and 9700X processors.

Regarding warranty coverage specifically, it was previously reserved for the Ryzen 7 9700X and Ryzen 5 9600X running at the efficient 65W TDP, but most reviewers, and probably AMD itself, agreed that 105W TDP is where it should be now, so the new TDP It is under warranty without any gaps. But still make sure you keep temperatures under control with adequate cooling.

The 1.2.0.2 BIOS update reported increased core-to-core latency between Ryzen 7000 and 9000 series multi-CCD models. The update reduces latency on multi-CCD models by optimizing data operations between cores. This improvement is most noticeable in thread-intensive games that don’t trigger core parking, such as Metro, Starfield, and Borderlands 3.

For those who want the latest and best, the X870 platform consisting of X870+X870E motherboards is currently being launched as we speak. Featuring a full-speed PCIe 5.0 slot and NVMe slots for maximum bandwidth in 2024, as well as onboard USB4 for high-speed communications and data transfer, the X870 handles everything from overclocking to everyday use.

As a final note, AMD EXPO now supports DDR5-8000 profiles over the previous DDR5-6000; This is overall pretty good for boosting system performance with a few simple clicks.